Platamid^® Hot Melt Adhesives

High efficiency long chain thermoplastic copolyamide hot melt adhesives for both woven and non-woven substrates. Plasticizer free. Also used as fusible filaments in the construction of thermoformable shoe uppers.

Premium Adhesion Performance

Platamid^® copolyamides are plasticizer-free thermoplastic hot melt adhesives (HMA) tailored to deliver durable, versatile, and solvent-free bonding. Platamid^® holt melt adhesives are designed to address the highly demanding bonding challenges of markets such as textile interlining, technical textiles, construction, electronics, and automotive headliners.

Also used as fusible filaments in the construction of highly advanced thermoformable sports shoe uppers.

Eliminates seams and stitches!

Primary Applications

Platamid^® adhesive offers resistant and durable adhesion for a variety of industrial applications including:

Woven and non-woven textiles: silk, wool, cotton, cellulose, polymer fibers and leather
Many different kinds of foam, such as TPUVersatile plastics, such as plasticized and rigid PVC, PU, ABS, Epoxy, etc.
Rubbers (NBR)
Metals
Non-woven web adhesives for automotive headliners
Fusible filaments for shoe uppers, ladies garments and mops/rollers/buffing pads

Primary Features

Melting Points from 85°C to 150°C
Low density = light weight
Viscosities from 40 to 4,000 Pa.s at 150°C
Available as pellets or free-flowing powders
Highly effective on polar substrates
Good resistance to chemicals, hydrolysis, heat, UV
Excellent laundry and dry cleaning resistance
Short setting time = high production rates
Plasticizer-free
Outstanding specific adhesion
May also be solubilized in certain solvents to make solution coatings with tremendous barrier properties